Compact thermal modeling for temperature-aware design

Proceedings - Design Automation Conference

Volumn , Issue , 2004, Pages 878-883

  Huang, Wei ^a   Stan, Mircea R ^a   Skadron, Kevin ^b   Sankaranarayanan, Karthik ^b   Ghosh, Shougata ^a,b   Velusamy, Sivakumar ^b  

^a UNIVERSITY OF VIRGINIA   (United States)

^b University of Virginia   (United States)

Author keywords

Leakage; Power aware design; Reliability; Temperature aware computing; Temperature aware design; Thermal model

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; THERMAL EFFECTS;

TEMPERATURE-AWARE COMPUTING; TEMPERATURE-AWARE DESIGN; THERMAL DESIGN; THERMAL MODELS;

CMOS INTEGRATED CIRCUITS;

EID: 4444374512     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/996566.996800     Document Type: Conference Paper

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