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Volumn , Issue , 2001, Pages 681-684
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Thermal analysis of heterogeneous 3-D ICs with various integration scenarios
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
CAPACITANCE;
COMPUTER SIMULATION;
CURRENT DENSITY;
ELECTRIC CONDUCTIVITY;
FINITE ELEMENT METHOD;
HEAT LOSSES;
HEAT RESISTANCE;
INTEGRATED CIRCUIT LAYOUT;
OPTICAL INTERCONNECTS;
THERMAL CONDUCTIVITY;
THERMOANALYSIS;
THREE DIMENSIONAL;
ANSYS SOFTWARE PACKAGE;
ELECTRICAL THERMAL ANALOGY;
ELMORE DELAY MODEL;
INTERLAYER DIELECTRICS;
TWO LAYER THREE DIMENSIONAL STRUCTURE;
WAFER BONDING TECHNIQUE;
INTEGRATED CIRCUITS;
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EID: 0035715858
PISSN: 01631918
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (102)
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References (11)
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