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Volumn , Issue , 2001, Pages 681-684

Thermal analysis of heterogeneous 3-D ICs with various integration scenarios

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; CURRENT DENSITY; ELECTRIC CONDUCTIVITY; FINITE ELEMENT METHOD; HEAT LOSSES; HEAT RESISTANCE; INTEGRATED CIRCUIT LAYOUT; OPTICAL INTERCONNECTS; THERMAL CONDUCTIVITY; THERMOANALYSIS; THREE DIMENSIONAL;

EID: 0035715858     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (102)

References (11)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.