CMOS-MEMS lateral electrothermal actuators

Journal of Microelectromechanical Systems

Volumn 17, Issue 1, 2008, Pages 103-114

  Gilgunn, Peter J ^a   Liu, Jingwei ^a   Sarkar, Niladri ^b,c   Fedder, Gary K ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b ZYVEX CORPORATION   (United States)

^c UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Actuators; CMOS MEMS; Electrothermal (ET); In plane; Microelectromechanical system (MEMS); Multimorph; Self assembly

Indexed keywords

CMOS INTEGRATED CIRCUITS; FINITE ELEMENT METHOD; JOULE HEATING; MATHEMATICAL MODELS; MEMS; MICROMACHINING; SELF ASSEMBLY; THERMAL EXPANSION;

EFFICIENCY-VOLUME RATIO; ELECTROTHERMAL ACTUATORS; THERMAL SENSITIVITY;

ACTUATORS;

EID: 40449095422     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.911373     Document Type: Article

References (39)

1. H. Xie and G. K. Fedder, "Vertical comb-finger capacitive actuation and sensing for CMOS-MEMS," Sens. Actuators A, Phys., vol. 95, no. 2, pp. 212-221, Jan. 2002.
2. S. Todd, A. Jain, H. Qu, and H. Xie, "A multi-degree-of-freedom micromirror utilizing inverted-series-connected bimorph actuators," J. Opt. A: Pure Appl. Opt., vol. 8, no. 7, pp. S352-S359, Jul. 2006.
3. H. Q. Li, D. C. Roberts, J. L. Steyn, K. T. Turner, O. Yaglioglu, N. W. Harwood, S. M. Spearing, and M. A. Schmidt, "Fabrication of a high frequency piezoelectric microvalve," Sens. Actuators A, Phys., vol. 111, no. 1, pp. 51-56, Mar. 2004.
4. J. W. Judy and R. S. Muller, "Magnetically actuated, addressable microstructures," J. Microelectromech. Syst., vol. 6, no. 3, pp. 246-256, Sep. 1997.
5. H. Zeng, A. D. Feinerman, Z. Wan, and P. R. Patel, "Piston-motion micromirror based on electrowetting of liquid metals," J. Microelectromech. Syst., vol. 14, no. 2, pp. 285-294, Apr. 2005.
6. N. J. Grabham, N. M. White, and S. P. Beeby, "Thick-film magnetostrictive material for MEMS," Electron. Lett., vol. 36, no. 4, pp. 332-334, Feb. 2000.
7. D. Jenkins, E. Fribourg-Blanc, E. Cattan, and D. Remiens, "The linearization of an electrostrictive device for MEMS applications," in Proc. 13th IEEE Int. Symp. Appl. Ferroelectr., Nara, Japan, 2002, pp. 479-482.
8. A. Oz and G. Fedder, "CMOS/BICMOS self-assembling and electrothermal microactuators for tunable capacitors, gap-closing structures and latch mechanisms," in Proc. Solid-State Sens. Actuators Workshop, Tech. Dig., Hilton Head Island, SC, 2004, pp. 215-221.
9. G. Fedder, S. Santhanam, M. L. Reed, S. C. Eagle, D. F. Guillou, M. S. Lu, and R. Carley, "Laminated high-aspect-ratio microstructures in a conventional CMOS process," Sens. Actuators A, Phys., vol. 57, no. 2, pp. 103-110, Nov. 1996.
10. N. Sarkar, C. Baur, E. Stach, Z. Jandric, R. Stallcup, M. Ellis, G. Skidmore, J. Liu, and G. K. Fedder, "Modular MEMS experimental platform for transmission electron microscopy," in Proc. IEEE 19th Int. Conf. MicroElectroMech. Syst., Istanbul, Turkey, 2006, pp. 146-149.
11. D. Ramachandran, A. Oz, V. K. Saraf, G. K. Fedder, and T. Mukherjee, "MEMS - Enabled reconfigurable VCO and RF filter," in Proc. IEEE RF IC Symp., Fort Worth, TX, Jun. 2004, pp. 251-254.
12. J. H. Comtois, M. A. Michalichek, and C. C. Barron, "Electrothermal actuators fabricated in four-level planarized surface micromachined polycrystalline silicon," Sens. Actuators A, Phys., vol. 70, no. 1/2, pp. 23-31, 1998.
13. J. W. Judy, T. Tamagawa, and D. L. Polla, "Surface micromachined linear thermal microactuator," in IEDM Tech. Dig., San Francisco, CA, 1990, pp. 629-632.
14. H. Guckel, J. Klein, T. Christenson, K. Skrobis, M. Laudon, and E. G. Lovell, "Thermo-magnetic metal flexure actuators," in Proc. IEEE Solid-State Sens. Actuators Workshop, Tech. Dig., Hilton Head Island, SC, 1992, pp. 73-75.
15. J. H. Comtois, V. M. Bright, and M. W. Phipps, "Thermal microactuators for surface-micromachining processes," in Proc. SPIE Micromachined Devices Components, Sep. 1995, vol. 2642, pp. 10-21.
16. D. M. Burns and V. M. Bright, "Design and performance of a double hot arm polysilicon thermal actuator," in Proc. SPIE - Micromachined Devices Components III, 1997, vol. 3224, pp. 296-306.
17. J. M. Noworolski, E. H. Klaasen, J. R. Logan, K. E. Petersen, and N. I. Maluf, "Process for in-plane and out-of-plane single-crystal-silicon thermal microactuators," Sens. Actuators A, Phys., vol. 55, no. 1, pp. 65-69, Jul. 1996.
18. Y. B. Gianchandani and K. Najafi, "Bent-beam strain sensors," J. Microelectromech. Syst., vol. 5, no. 1, pp. 52-58, Mar. 1996.
19. L. Que, J. Park, and Y.B. Gianchandani, "Bent-beam electrothermal actuators - Part 1: Single beam and cascaded devices," J. Microelectromech. Syst., vol. 10, no. 2, pp. 247-254, Jun. 2001.
20. H. Sehr, A. G. R. Evans, A. Brunnschweiler, G. J. Ensell, and T. E. G. Niblock, "Fabrication and test of thermal vertical bimorph actuators for movement in the wafer plane," J. Micromech. Microeng., vol. 11, no. 4, pp. 306-310, Jul. 2001.
21. S. Timoshenko, "Analysis of bi-metal thermostats," J. Opt. Soc. Amer., vol. 11, no. 3, pp. 233-255, May 1925.
22. S. Senturia, Microsystem Design. Norwell, MA: Kluwer, 2001.
23. J. M. Gere and S. P. Timoshenko, Mechanics of Materials, 4th ed. Boston, MA: PWS-Kent, 1997.
24. CRC Materials Science and Engineering Handbook, CRC Press, Boca Raton, FL, 2001.
25. F. P. Incropera and D. P. DeWitt, Fundamental of Heat and Mass Transfer, 5th ed. Hoboken, NJ: Wiley, 2002.
26. G. Chen, D. Borca-Tasciuc, and R. G. Yang, "Nanoscale heat transfer," in Encyclopedia Nanoscience and Nanotechnology, 1st ed. Valencia, CA: Amer. Sci. Publishers, 2004.
27. S. Todd and H. Xie, "Steady-state 1D electrothermal modeling of an electrothermal transducer," J. Micromech. Microeng., vol. 15, no. 12, pp. 2264-2276, Dec. 2005.
28. D. Hill, W. Szyszkowski, and E. Bordatchev, "On modeling and computer simulation of an electro-thermally driven cascaded nickel micro-actuator," Sens. Actuators A, Phys., vol. 126, no. 1, pp. 257-263, Jan. 2006.
29. H. Xie, Y. Pan, and G. Fedder, "A CMOS-MEMS mirror with curled-hinge comb drives," J. Microelectromech. Syst., vol. 12, no. 4, pp. 450-457, Aug. 2003.
30. W. D. Nix, "Mechanical properties of thin films," Metall. Trans. A vol. 20 A, no. 11, pp. 2217-2245, Nov. 1989.
31. J. Zhao, T. Ryan, P. S. Ho, A. J. McKerrow, and W. Shih, "Measurement on elastic modulus, poisson ratio, and coefficient of thermal expansion of on-wafer submicron films," J. Appl. Phys., vol. 85, no. 9, pp. 6421-6424, May 1999.
32. H. Tada, A. E. Kumpel, R. E. Lathrop, J. B. Slanina, P. Nieva, and P. S avracky, "Thermal expansion coefficient of polycrystalline silicon and silicon dioxide thin films at high temperatures," J. Appl. Phys., vol. 87, no. 9, pp. 4189-4193, May 2000.
33. M. Agarwal, D. T. Dutton, J. A. Theil, Q. Bai, E. Par, and S. Hoen, "Characterization of a dipole surface drive actuator with large travel and force," J. Microelectromech. Syst., vol. 15, no. 6, pp. 1726-1734, Dec. 2006.
34. P. Krulevitch, A. P. Lee, P. B. Ramsey, J. C. Trevino, J. Hamilton, and M. A. Northrup, "Thin film shape memory alloy microactuators," J. Microelectromech. Syst., vol. 5, no. 4, pp. 270-282, Dec. 1996.
35. D. J. Bell, T. J. Lu, N. A. Heck, and M. Spearing, "MEMS actuators and sensors: Observations on their performance and selection for purpose," J. Micromech. Microeng., vol. 15, no. 7, pp. S153-S164, Jul. 2005.
36. S. Prasanna and S. M. Spearing, "Materials selection and design of microelectromechanical bimaterial actuators," J. Microelectromech. Syst., vol. 16, no. 2, pp. 248-259, Apr. 2007.
37. J. D. Grade, H. Jerman, and T. W. Kenny, "Design of large deflection electrostatic actuators," J. Microelectromech. Syst., vol. 12, no. 3, pp. 335-343, Jun. 2003.
38. H. Rothuizen, M. Despont, U. Dreschler, G. Genolet, W. Häberle, M. Lutwyche, R. Stutz, and P. Vettiger, "Compact copper/epoxy-based electromagnetic scanner for scanning probe applications," in Proc. IEEE 15th Int. Conf. MicroElectroMech. Syst., Las Vegas, NV, 2002, pp. 582-585.
39. M. Kohl and K. D. Skrobanek, "Linear microactuators based on the shape memory effect," in Proc. Int. Conf. Solid State Sens. Actuators, Tech. Dig, Chicago, IL, 1997, pp. 785-788.