Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder by serial sectioning

Materials Characterization

Volumn 52, Issue 3, 2004, Pages 225-230

  Sidhu, R S ^a   Chawla, N ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COOLING; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; INTERMETALLICS; MATHEMATICAL MODELS; MORPHOLOGY; NUCLEATION; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS;

COMPUTER-AIDED RECONSTRUCTION; DIAGONALS; HIGH TEMPERATURE RESISTANCE; SERIAL SECTIONING;

SILVER ALLOYS;

EID: 3342877548     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2004.04.010     Document Type: Article

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