Effect of cooling rate on microstructure of Ag-Cu-Sn solder alloys

Materials Science and Technology

Volumn 21, Issue 1, 2005, Pages 61-68

  Snugovsky, L ^a   Snugovsky, P ^b   Perovic, D D ^a   Rutter, J W ^a  

^a UNIVERSITY OF TORONTO   (Canada)

^b Celestica Inc   (Canada)

Author keywords

Cooling rate; Microstructure; Sn Ag Cu alloy; Solidification

Indexed keywords

COOLING; ENERGY DISPERSIVE SPECTROSCOPY; MICROSTRUCTURE; PHASE DIAGRAMS; SILICON CARBIDE; SOLDERING; SOLIDIFICATION; TERNARY SYSTEMS;

COOLING RATE; ELECTRON PROBE MICROANALYZER (EPMA); SN-AG-CU ALLOYS; TERNARY EUTECTIC COMPOSITION;

SILVER ALLOYS;

EID: 17044414850     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328405X14047     Document Type: Conference Paper

References (14)

1. S. K. Kang and A. K. Sarkhel: J. Electron. Mater., 1994, 23, 701.
2. D. M. Jacobson and M. R. Harrison: GEC J. Technol., 1997, 14, 98.
3. J. Glazer: Int. Mater. Rev., 1995, 40, 65.
4. C. M. Miller, I. E. Anderson and J. F. Smith: J. Electron. Mater., 1994, 23, 595.
5. 'IPC roadmap: a guide for assembly of lead-free electronics', Draft IV, June 2000, Internet http://www.ipc.org/
6. H.-J. Albrecht, D. S. Brodie, A. J. Gunn, W. H. Muller and R. L. Reuben: J. Surf. Mount Technol., 2002, 15, 30.
7. 'Test procedures for developing solder data', (ed. T. A. Stewart and C. A. Handwerker), NIST special publication 960-8, August 2002.
8. L. Snugovsky, C. Cermignani, D. D. Perovic and J. W. Rutter: J. Electron. Mater., 2004, 33, (11).
9. C. E. Homer and H. Plummer: J. Inst. Met., 1939, 64, 169.
10. D. Lewis, S. Allen, M. Notis and A. Scotch: J. Electron. Mater., 2002, 31, 161.
11. A. Kofler: Z. Metallkd., 1950, 41, 221.
12. K.-W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello and C. A. Handwerker: J. Electron. Mater., 2000, 29, 1122.
13. K. P. Young, B. A. Rickinson and M. C. Flemings: 'Solidification and casting of metals', 539; 1979, London, The Metals Society.
14. J. D. Holder and B. F. Oliver: Metall. Trans., 1974, 5, 2423.