Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic snpb solder for flip chip technology

Applied Physics Letters

Volumn 79, Issue 4, 2001, Pages 482-484

  Jang, J W ^a   De Silva, A P ^a   Lee, T Y ^a   Lin, J K ^a   Frear, D R ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035939334     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1388160     Document Type: Article

References (15)

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