Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 2, 1996, Pages 208-212

  Bonda, N R ^b   Noyan, I C ^a,c  

^a IEEE

^b MOTOROLA INC   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD ALLOYS; SOLDERED JOINTS; STRAIN; SURFACE MOUNT TECHNOLOGY; TENSILE STRENGTH; VLSI CIRCUITS; VOLUME MEASUREMENT;

CYCLIC LOADING; EUTECTIC ALLOY; REPRESENTATIVE DEFORMATION VOLUME; TENSILE STRAIN;

SOLDERING ALLOYS;

EID: 0030173970     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.506106     Document Type: Article

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