Prediction of electronic component-board transient conjugate heat transfer

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 817-829

  Eveloy, Valérie ^a   Rodgers, Peter ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Assembly; Benchmark; Component; Computational fluid dynamics (CFD); Conjugate; Electronics cooling; Heat transfer; Numerical modeling; Prediction; Printed circuit board (PCB); Reliability; Transient; Virtual prototyping

Indexed keywords

BENCHMARKING; BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRONIC EQUIPMENT MANUFACTURE; HEAT TRANSFER; SURFACE MOUNT TECHNOLOGY; THERMOANALYSIS; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

ELECTRONICS COOLING; PLASTIC QUAD FLAT PACK; VIRTUAL PROTOTYPING;

PRINTED CIRCUIT BOARDS;

EID: 29244487899     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848586     Document Type: Article

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