A multi-scale conjugate thermal modeling approach for air cooled electronic enclosures

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 295-300

  Tang, Lan ^a   Joshi, Yogendra K ^b  

^a Power and Packaging   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347032846     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (17)

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