Strength evaluation of plastic packages during solder reflow process using stress intensity factors of V-notch

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 31-38

  Ikeda, Toru ^a   Arase, Isao ^a   Ueno, Yuya ^a   Miyazaki, Noriyuki ^a   Ito, Nobutaka ^b   Nagatake, Mami ^b   Sato, Mitsuru ^b  

^a KYUSHU UNIVERSITY   (Japan)

^b FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; DISSIMILAR MATERIALS; ESTIMATION; EVALUATION; EXTRAPOLATION; FINITE ELEMENT METHOD; MOISTURE; SOLDERING; STRENGTH OF MATERIALS; STRESS INTENSITY FACTORS; THREE DIMENSIONAL; VAPOR PRESSURE;

CRITICAL VAPOR PRESSURE; DISPLACEMENT EXTRAPOLATION METHOD; QUAD FLAT PACKAGE; SOLDER REFLOW PROCESS; V-NOTCH CORNER;

ELECTRONICS PACKAGING;

EID: 0344982116     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1525244     Document Type: Article

References (9)

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