An experimental assessment of compact thermal models for the prediction of board-mounted electronic component heat transfer

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 300-312

  Eveloy, Valérie ^a,b   Rodgers, Peter ^a   DeVoe, Jason ^c   Ortega, Alfonso ^c   Hashmi, M S J ^b  

^a Electronics Thermal Management Ltd   (Ireland)

^b DUBLIN CITY UNIVERSITY   (Ireland)

^c University of Arizona   (United States)

Author keywords

Benchmark; CFD; Compact thermal models; Component modeling; PQFP; Printed circuit board; SO

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; ELECTRIC NETWORK ANALYSIS; HEAT TRANSFER; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE TESTING; STATISTICAL METHODS; TEMPERATURE MEASUREMENT; THERMOGRAPHY (IMAGING); AMPHIBIOUS VEHICLES; ATMOSPHERIC TEMPERATURE; CHIP SCALE PACKAGES; CRASHWORTHINESS; ELECTRONICS PACKAGING; FLUID DYNAMICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICES; SEMICONDUCTOR JUNCTIONS; THERMAL VARIABLES MEASUREMENT; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

COMPACT THERMAL MODELS; COMPONENT JUNCTION TEMPERATURE; INFRARED THERMOGRAPHY; THERMAL TEST CHIPS;

SEMICONDUCTOR DEVICE MODELS; PRINTED CIRCUIT BOARDS;

ACCURACY; CIRCUIT TESTING; ELECTRONIC COMPONENT; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; PERFORMANCE ANALYSIS; PREDICTIVE MODELS; SEMICONDUCTOR DEVICE MEASUREMENTS;

EID: 0037277871     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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