Numerical prediction of electronic component operational temperature: A perspective

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 268-282

  Eveloy, Valérie ^a   Rodgers, Peter ^b   Hashmi, M S J ^c  

^a Electronics Thermal Management Ltd   (Ireland)

^b UNIVERSITY OF MARYLAND   (United States)

^c DUBLIN CITY UNIVERSITY   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; COMPUTATIONAL FLUID DYNAMICS; COOLING; FLOW VISUALIZATION; HEAT TRANSFER; MATHEMATICAL MODELS; PRINTED CIRCUIT DESIGN; RELIABILITY; TEMPERATURE MEASUREMENT; THERMOANALYSIS;

COMPONENT JUNCTION TEMPERATURE; CRITICAL TEMPERATURE PREDICTIONS; ELECTRONIC COMPONENT OPERATIONAL TEMPERATURE; ELECTRONICS COOLING MODELING; VIRTUAL PROTOTYPING;

PRINTED CIRCUIT BOARDS;

EID: 3242764541     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828583     Document Type: Article

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