An investigation into the potential of low-Reynolds number eddy viscosity turbulent flow models to predict electronic component operational temperature

Journal of Electronic Packaging

Volumn 127, Issue 1, 2005, Pages 67-75

  Rodgers, Peter ^a   Eveloy, Valérie ^a   Hashmi, M S J ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b DUBLIN CITY UNIVERSITY   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; HEAT TRANSFER; INDUCTION HEATING; INTEGRATED CIRCUITS; PARAMETER ESTIMATION; REYNOLDS NUMBER; TURBULENT FLOW; VISCOSITY;

ELECTRONIC COMPONENT; OPERATIONAL TEMPERATURE; PREDICTION METHODS; THERMAL INTERACTION;

PRINTED CIRCUIT BOARDS;

EID: 18744362176     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1849234     Document Type: Article

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