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Volumn 119, Issue 3, 1997, Pages 401-405

Thermal conductivity measurements in printed wiring boards

Author keywords

Conduction; Measurement techniques; Thermal packaging

Indexed keywords

ANISOTROPY; COPPER; EPOXY RESINS; GLASS; HEAT CONDUCTION; PRINTED CIRCUIT BOARDS; THERMAL INSULATING MATERIALS; THERMAL VARIABLES MEASUREMENT;

EID: 1242350953     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.2824111     Document Type: Article
Times cited : (33)

References (13)
  • 2
    • 0029701491 scopus 로고    scopus 로고
    • Proceedings of the IEEE Semiconductor Thermal Measurement and Management Symposium, (SEMI-THERM), Austin, TX, March 5-7
    • Azar, K., and Graebner, J. E., 1996, “Experimental Determination of Thermal Conductivity of Printed Wiring Boards,” Proceedings of the IEEE Semiconductor Thermal Measurement and Management Symposium, (SEMI-THERM), Austin, TX, March 5-7, pp, 169-182
    • (1996) Experimental Determination of Thermal Conductivity of Printed Wiring Boards , pp. 169-182
    • Azar, K.1    Graebner, J.E.2
  • 3
    • 3743088974 scopus 로고
    • Effect of Board Conductivity and Air Velocity on Heat Transfer from an Electronic Component
    • New Orleans, LA
    • Azar, K., and Yuan, T. D., 1993, “Effect of Board Conductivity and Air Velocity on Heat Transfer from an Electronic Component,” Proceedings of the Winter Conference of the ASME, New Orleans, LA
    • (1993) Proceedings of the Winter Conference of the ASME
    • Azar, K.1    Yuan, T.D.2
  • 5
    • 0029724496 scopus 로고    scopus 로고
    • Thermal Analysis of Circuit Boards and Microelectronic Components Using an Analytical Solution to the Heat Conduction Equation
    • (SEMI-THERM), Austin, TX, March 5-7
    • Ellison, G. N., 1996, “Thermal Analysis of Circuit Boards and Microelectronic Components Using an Analytical Solution to the Heat Conduction Equation,” Proceedings of the IEEE Semiconductor Thermal Measurement and Management Symposium, (SEMI-THERM), Austin, TX, March 5-7, pp. 144-150
    • (1996) Proceedings of the IEEE Semiconductor Thermal Measurement and Management Symposium , pp. 144-150
    • Ellison, G.N.1
  • 6
    • 3743120188 scopus 로고
    • Thermal Conductivity of Printed Wiring Boards
    • Graebner, J. E., 1995, “Thermal Conductivity of Printed Wiring Boards.” Electronics Cooling, Vol. 1, p. 27
    • (1995) Electronics Cooling , vol.1 , pp. 27
    • Graebner, J.E.1
  • 10
    • 0029721729 scopus 로고    scopus 로고
    • Use of a One-dimensional Heat Flow Model to Calculate Circuit Board Thermal Resistance for use in the MQUAD Package Thermal Model
    • (SEMI-THERM), Austin, TX, March 57
    • Robinson, P., and Mravic, B., 1996, “Use of a One-dimensional Heat Flow Model to Calculate Circuit Board Thermal Resistance for use in the MQUAD Package Thermal Model,” Proceedings of the IEEE Semiconductor Thermal Measurement and Management Symposium, (SEMI-THERM), Austin, TX, March 57, pp. 191-200
    • (1996) Proceedings of the IEEE Semiconductor Thermal Measurement and Management Symposium , pp. 191-200
    • Robinson, P.1    Mravic, B.2
  • 11
    • 51249173521 scopus 로고
    • PCB Glass-Fibre Laminates: Thermal Conductivity Measurements and Their Effect on Simulation
    • Sarvar, F., Poole, N. J., and Witting, P. A., 1990, “PCB Glass-Fibre Laminates: Thermal Conductivity Measurements and Their Effect on Simulation,” Journal of Electronic Materials, Vol. 19, pp. 1345-1350
    • (1990) Journal of Electronic Materials , vol.19 , pp. 1345-1350
    • Sarvar, F.1    Poole, N.J.2    Witting, P.A.3
  • 12
    • 0027841452 scopus 로고
    • An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards
    • Stefani, G. G., Goel, N. S., and Jenks, D. B., 1993, “An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards,” ASME Journal of Elkctronic Packaging, Vol. 115, pp. 366-371
    • (1993) ASME Journal of Elkctronic Packaging , vol.115 , pp. 366-371
    • Stefani, G.G.1    Goel, N.S.2    Jenks, D.B.3
  • 13
    • 3743084719 scopus 로고
    • An Experimental Method to Determine the Effective Thermal Conductivity of Printed Circuit Boards
    • C. J. Hoogendoorn, R. A. W. M., Henkes, and C. J. M. Lasance, eds., Proceedings of EUROTHERM Seminar 29, Delft, The Netherlands
    • Vanlaer, H. J. L., and Lasance, C. J. M., 1994, “An Experimental Method to Determine the Effective Thermal Conductivity of Printed Circuit Boards,” in: Thermal Management of Electronic Systems, C. J. Hoogendoorn, R. A. W. M., Henkes, and C. J. M. Lasance, eds., Proceedings of EUROTHERM Seminar 29, Delft, The Netherlands, pp. 201-210
    • (1994) Thermal Management of Electronic Systems , pp. 201-210
    • Vanlaer, H.J.L.1    Lasance, C.J.M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.