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Volumn , Issue , 2002, Pages 993-1000
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Finite element modelling of a BGA package subjected to thermal and power cycling
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Author keywords
Accelerated thermal cycling; Power cycling; Solder joint reliability; Submodelling; Substructuring
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Indexed keywords
COMPUTER SIMULATION;
FATIGUE OF MATERIALS;
FINITE ELEMENT METHOD;
THERMAL CYCLING;
VISCOPLASTICITY;
BALL GRID ARRAYS (BGA);
SOLDERED JOINTS;
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EID: 0036459518
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (13)
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References (9)
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