메뉴 건너뛰기




Volumn , Issue , 2002, Pages 993-1000

Finite element modelling of a BGA package subjected to thermal and power cycling

Author keywords

Accelerated thermal cycling; Power cycling; Solder joint reliability; Submodelling; Substructuring

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; THERMAL CYCLING; VISCOPLASTICITY;

EID: 0036459518     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (13)

References (9)
  • 2
    • 0000564167 scopus 로고
    • Thermal and power cycling limits of plastic ball grid array (PBGA) assemblies
    • R. Darveaux, A. Mawer, "Thermal and Power Cycling Limits of Plastic Ball Grid Array (PBGA) Assemblies", Proceedings of Surface Mount International, pp. 315-326, 1995.
    • (1995) Proceedings of Surface Mount International , pp. 315-326
    • Darveaux, R.1    Mawer, A.2
  • 3
    • 0034479828 scopus 로고    scopus 로고
    • Effect of simulation methodology on solder joint crack growth correlation
    • th IEEE, 2000.
    • (2000) th IEEE
    • Darveaux, R.1
  • 4
    • 0032638487 scopus 로고    scopus 로고
    • Implementation of and extensions to Darveaux's approach to finite element simulation of BGA solder joint reliability
    • th IEEE, 1999.
    • (1999) th IEEE
    • Johnson, Z.1
  • 7
    • 0012040186 scopus 로고    scopus 로고
    • Swanson Analysis Systems Inc.
    • ANSYS™ 5.7 Users Manual, Swanson Analysis Systems Inc., 2001.
    • (2001) ANSYS™ 5.7 Users Manual
  • 8
    • 0034273667 scopus 로고    scopus 로고
    • Reliability and failure analyses of thermally cycled ball grid array assemblies
    • September
    • R. Ghaffarian, N.P. Kim, "Reliability and Failure Analyses of Thermally Cycled Ball Grid Array Assemblies", IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 528-534, September 2000.
    • (2000) IEEE Transactions on Components and Packaging Technologies , vol.23 , Issue.3 , pp. 528-534
    • Ghaffarian, R.1    Kim, N.P.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.