A Life Consumption Monitoring Methodology for Electronic Systems

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 625-634

  Ramakrishnan, Arun ^b   Pecht, Michael G ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b AGERE SYSTEMS   (United States)

Author keywords

Humidity; Life consumption; Physics of failure; Printed circuit board; Radiation; Temperature cycling; Vibration

Indexed keywords

PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; VIBRATIONS (MECHANICAL);

LIFE CONSUMPTION;

ELECTRONICS PACKAGING;

EID: 0142227054     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817654     Document Type: Article

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