Strategy for designing accelerated aging tests to evaluate IGBT power modules lifetime in real operation mode

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 2, 2003, Pages 429-438

  Thébaud, Jean Marc ^a   Woirgard, Eric ^a   Zardini, Christian ^a   Azzopardi, Stéphane ^a   Briat, Olivier ^a   Vinassa, Jean Michel ^a  

^a UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

Accelerated aging tests; Energy calculations; Finite element simulations; Solder joint; Thermal fatigue

Indexed keywords

AGING OF MATERIALS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT RESISTANCE; SOLDERED JOINTS; STRESS ANALYSIS; THERMAL EXPANSION;

ACCELERATED AGING TESTS; THERMAL FATIGUE;

INSULATED GATE BIPOLAR TRANSISTORS;

EID: 0041885409     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.815112     Document Type: Article

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