Development of compact thermal models for advanced electronic packaging: methodology and experimental validation for a single-chip CPGA package

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 225-232

  Aranyosi, Attila ^a   Ortega, Alfonso ^a   Evans, Jeremy ^a   Tarter, Thomas ^a   Pursel, John ^a   Radharkrishnan, Jagadeesh ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; BOUNDARY CONDITIONS; CERAMIC MATERIALS; ELECTRIC NETWORK TOPOLOGY; HEAT TRANSFER COEFFICIENTS; NONLINEAR PROGRAMMING; SUBSTRATES; THERMAL EFFECTS;

COMPACT THERMAL MODEL; HARD BOUNDARY CONDITION; NONLINEAR PROGRAMMING ALGORITHM; PACKAGE THERMAL MODEL;

ELECTRONICS PACKAGING;

EID: 0033677931     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (14)