Transient thermal analysis of an ACF package assembly process

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 4, 2001, Pages 673-681

  Chiriac, Victor Adrian ^b   Lee, Tien Yu Tom ^a,b  

^a IEEE

^b Advanced Interconnect Systems Lab   (United States)

Author keywords

Anisotropic conductive film; Assembly; Computational fluid dynamics; Convective cooling; Electronic package; Manufacturing; Thermal performance; Transient

Indexed keywords

APPROXIMATION THEORY; CHIP SCALE PACKAGES; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRON DEVICE MANUFACTURE; SUBSTRATES; THERMAL EFFECTS;

ANISOTROPIC CONDUCTIVE FILMS (ACF);

CONDUCTIVE FILMS;

EID: 0035694172     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.974960     Document Type: Article

References (12)

1. Flip chip assembly utilizing anisotropic conductive films: A feasibility study
2. Flip chip interconnection technology using anisotropic conductive adhesive films
3. Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuits
4. Anisotropic conductive film
5. Structural reliability of direct-chip_attaches bonded with anisotropic conductive film
6. Overview of conductive adhesive interconnection technologies for LCD's
7. The contact resistance and reliability of anistropically conductive film (ACF)
8. Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates
9. Structural reliability of direct-chip-attaches bonded with anisotropic conductive film