Thermal interaction between electronic components

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 329, Issue , 1996, Pages 73-82

  Lohan, John M ^a   Davies, Mark R D ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

AIR; CALCULATIONS; CHANNEL FLOW; ELECTRONIC EQUIPMENT; HEAT RESISTANCE; PRINTED CIRCUIT BOARDS; TEMPERATURE; VELOCITY;

ELECTRONIC COMPONENTS; JUNCTION TO AMBIENT THERMAL RESISTANCE; STANDARD TEST METHOD;

COMPONENTS;

EID: 0030410723     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (23)

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