The effect of cooling rate on the growth of Cu-Sn intermetallics in annealed PBGA solder joints

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 153-156

  Chan, Y C ^a   Fan, S H ^a   Lai, J K L ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Cooling rate; Cu Sn intermetallics; Intermetallic compound growth; Plastic BGA; Solder joint

Indexed keywords

AGING OF MATERIALS; ANNEALING; COOLING; COPPER ALLOYS; DIFFUSION; EUTECTICS; GROWTH (MATERIALS); INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; SOLDERED JOINTS; SOLIDIFICATION; THERMAL EFFECTS;

COOLING RATE; DIFFUSION CONTROLLED PROCESS; HEAT TRANSMISSION; MICROSTRUCTURAL EVOLUTION;

ELECTRONICS PACKAGING;

EID: 0344982093     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1537070     Document Type: Article

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