Effects of grain orientation on preferred abnormal grain growth in copper films on silicon substrates

Journal of Materials Science Letters

Volumn 18, Issue 6, 1999, Pages 471-473

  Zhang, Jianmin ^a   Xu, Kewei ^a   He, Jiawen ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL LATTICES; CRYSTAL ORIENTATION; ELASTIC MODULI; INTERFACIAL ENERGY; MATHEMATICAL MODELS; METALLIC FILMS; POISSON RATIO; SEMICONDUCTING SILICON; THERMAL EXPANSION; THERMAL STRESS; THIN FILMS;

ABNORMAL GRAIN GROWTH; COEFFICIENT OF THERMAL EXPANSION; COPPER FILM; GRAIN ORIENTATION;

GRAIN GROWTH;

EID: 0033099235     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1006694414907     Document Type: Article

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