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Volumn 76, Issue 1-4, 2004, Pages 160-166
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High temperature behavior of Cu films studied in-situ by electron backscatter diffraction
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Author keywords
Cu film; Dislocation; In situ EBSD; Microstructure; Stress; Texture; Thin film
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Indexed keywords
ANNEALING;
BACKSCATTERING;
COPPER;
DIFFUSION IN SOLIDS;
ELECTRON DIFFRACTION;
SCANNING ELECTRON MICROSCOPY;
STRESSES;
X RAY DIFFRACTION;
LINE-WIDTH;
MICRO-TEXTURES;
STRAIN ENERGY;
WAFER CURVATURE;
METALLIC FILMS;
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EID: 4544255246
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2004.07.044 Document Type: Conference Paper |
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Times cited : (9)
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References (7)
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