Surface modification of SiLK® by graft copolymerization with 4-vinylpyridine for reduction in copper diffusion

Applied Surface Science

Volumn 225, Issue 1-4, 2004, Pages 144-155

  Zhu, Y Q ^a   Kang, E T ^a   Neoh, K G ^a   Chan, L ^b   Lai, D M Y ^c   Huan, A C H ^c  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

^c INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

4 Vinylpyridine; Adhesion; Copper diffusion; Graft copolymerization; SiLK ; ToF SIMS; XPS

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPOLYMERIZATION; DIFFUSION IN SOLIDS; METALLIC FILMS; MORPHOLOGY; SECONDARY ION MASS SPECTROMETRY; SILICON WAFERS; SINGLE CRYSTALS; SUBSTRATES; SURFACE TREATMENT; THERMOPLASTICS; X RAY PHOTOELECTRON SPECTROSCOPY;

4-VINYLPYRIDINE; COPPER DIFFUSION; GRAFT COPOLYMERIZATION; TOF-SIMS;

GRAFT COPOLYMERS;

EID: 1342287142     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2003.09.046     Document Type: Article

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