The enhancement of the adhesion of copper layers to Dow Cyclotene 3022 through metal sputtering

Applied Surface Science

Volumn 180, Issue 3-4, 2001, Pages 200-208

  Yang, D Q ^a   Sacher, E ^a   Griswold, E M ^b   Smith, G ^b  

^a ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

^b NORTEL NETWORKS   (Canada)

Author keywords

Adhesion; Dow Cyclotene; Metal sputtering

Indexed keywords

ADHESION; ANNEALING; ARGON; ATOMIC FORCE MICROSCOPY; SPUTTERING; SURFACE TREATMENT; TITANIUM; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

CYCLOTENE;

COPPER;

EID: 0035899518     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(01)00339-7     Document Type: Article

References (18)