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Volumn 398-399, Issue , 2001, Pages 657-662

Chemical interaction, adhesion and diffusion properties at the interface of Cu and plasma-treated thiophene-based plasma polymer (ThioPP) films

(4) Kim, K J a Lee, N E a Kim, M C a Boo, J H a

a Sungkyunkwan University (South Korea)

Author keywords

Plasma enhanced chemical vapor deposition; Thiophene based plasma polymer films; X Ray photoelectron spectroscopy

Indexed keywords

ADHESION; ANNEALING; ATOMIC FORCE MICROSCOPY; CHEMICAL BONDS; CONTACT ANGLE; CURRENT VOLTAGE CHARACTERISTICS; DIFFUSION IN SOLIDS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASTIC FILMS; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

PLASMA POLYMER FILMS;

THIN FILMS;

EID: 0035507848 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(01)01372-4 Document Type: Article

Times cited : (21)

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