SiLK polymer coating with low dielectric constant and high thermal stability for ULSI interlayer dielectric

Materials Research Society Symposium - Proceedings

Volumn 476, Issue , 1997, Pages 9-17

  Townsend, P H ^a   Martin, S J ^a   Godschalx, J ^a   Romer, D R ^a   Smith Jr , D W ^a   Castillo, D ^a   DeVries, R ^a   Buske, G ^a   Rondan, N ^a   Froelicher, S ^a   Marshall, J ^a   Shaffer, E O ^a   Im, J H ^a  

^a DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE TOUGHNESS; GLASS TRANSITION; MOLECULAR STRUCTURE; OLIGOMERS; PERMITTIVITY MEASUREMENT; PLASTIC COATINGS; POLYMERIZATION; REFRACTIVE INDEX; SUBSTRATES; THERMAL EXPANSION; THERMODYNAMIC STABILITY; THIN FILMS;

TOPOGRAPHIC PLANARIZATION;

DIELECTRIC FILMS;

EID: 0031372934     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-476-9     Document Type: Conference Paper

References (5)