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Langmuir

Volumn 21, Issue 1, 2005, Pages 195-202

Large-area patterning of coinage-metal thin films using Decal Transfer Lithography

(2) Childs, William R a Nuzzo, Ralph G a,b

a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN (United States)

b University of Illinois at Urbana Champaign (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COHESIVE MECHANICAL FAILURE (CMF) METHOD; COINAGE METALS; INVERSE MODELS; THIN FILM PATTERNS;

ADHESION; DEPOSITION; ETCHING; LITHOGRAPHY; METALLIC FILMS; METALLOGRAPHIC MICROSTRUCTURE; SELF ASSEMBLY; SURFACE TREATMENT;

THIN FILMS;

ADHESION; DEPOSITION; ETCHING; LITHOGRAPHY; MICROSTRUCTURE; SURFACE TREATMENT; THIN FILMS;

EID: 11844279699 PISSN: 07437463 EISSN: None Source Type: Journal
DOI: 10.1021/la047884a Document Type: Article

Times cited : (52)

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