Advanced silver-based metallization patterning for ULSI applications

Microelectronic Engineering

Volumn 55, Issue 1-4, 2001, Pages 383-388

  Alford, T L ^a   Nguyen, Phucanh ^a   Zeng, Yuxiao ^a   Mayer, J W ^a  

^a ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METALLIZING; PLASMAS; REACTIVE ION ETCHING; SILVER; THIN FILMS; ULSI CIRCUITS;

RESIST STRIPPING;

METALLIC FILMS;

EID: 0034824091     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00471-8     Document Type: Article

References (8)

1. D.R. Lide (Ed.), CRC Handbook of Chemistry and Physics, 72nd Edition, Chemical Rubber, 1991.
2. P. Nguyen, Y. Zeng, T.L. Alford, J. Vac. Sci. Technol. B 17 (5) (1999) 2204.
3. M.K. Bhan, P.K. Nag, G.P. Miller, J.C. Gregory, J. Vac. Sci. Technol. A 12 (1994) 699.
4. C.H. Chou, J. Phillips, J. Vac. Sci. Technol. A 9 (1991) 2727.
5. Design-Expert Version 5. Stat-Ease Corporation, Minneapolis, 1996.
6. D.M. Manos, D.L. Flamm, in: Plasma Etching: An Introduction, Academic Press, Cambridge, 1989.
7. M.A. Lieberman, A.J. Lichtenberg, in: Principles of Plasma Discharges and Materials Processing, Wiley, New York, 1994.
8. L.C. Feldman, J.W. Mayer, in: Fundamentals of Surface and Thin Film Analysis, North-Holland, New York, 1986.