-
1
-
-
0942269818
-
Integration of high-k gate stacks into planar scaled CMOS integrated circuits
-
H. R. Huff, A. Hou, C. Lim, Y. Kim, J. Barnett, G. Bersuker, G. A. Brown, C. D. Young, P. M. Zeitzoff, J. Gutt, P. Lysaght, M. I. Gardner, and R. W. Murto, "Integration of high-k gate stacks into planar scaled CMOS integrated circuits," Proc. Nano and Giga Challenges in Microelectronics, pp. 1-18, 2002.
-
(2002)
Proc. Nano and Giga Challenges in Microelectronics
, pp. 1-18
-
-
Huff, H.R.1
Hou, A.2
Lim, C.3
Kim, Y.4
Barnett, J.5
Bersuker, G.6
Brown, G.A.7
Young, C.D.8
Zeitzoff, P.M.9
Gutt, J.10
Lysaght, P.11
Gardner, M.I.12
Murto, R.W.13
-
2
-
-
37249039577
-
CMOS scaling and process history, design principles, and hardening by design methodologies
-
Monterey, CA, July
-
R. C. Lacoe, "CMOS scaling and process history, design principles, and hardening by design methodologies," in Proc. IEEE NSREC Short Course, Monterey, CA, July 2003, pp. 6-34.
-
(2003)
Proc. IEEE NSREC Short Course
, pp. 6-34
-
-
Lacoe, R.C.1
-
3
-
-
0016116644
-
Design of ion-implanted MOSFETs with very small device dimensions
-
Apr.
-
R. H. Dennard, F. H. Gaensslen, H.-N. Yu, V. L. Rideout, E. Bassous, and A. R. LeBlanc, "Design of ion-implanted MOSFETs with very small device dimensions," IEEE J. Solid-State Circuits, vol. 9, pp. 256-268, Apr. 1974.
-
(1974)
IEEE J. Solid-state Circuits
, vol.9
, pp. 256-268
-
-
Dennard, R.H.1
Gaensslen, F.H.2
Yu, H.-N.3
Rideout, V.L.4
Bassous, E.5
LeBlanc, A.R.6
-
4
-
-
0021516886
-
Evolution of the MOSFET dynamic RAM: A personal view
-
Nov.
-
R. H. Dennard, "Evolution of the MOSFET dynamic RAM: A personal view," IEEE Trans. Electron Device, vol. 31, pp. 1549-1555, Nov. 1984.
-
(1984)
IEEE Trans. Electron Device
, vol.31
, pp. 1549-1555
-
-
Dennard, R.H.1
-
5
-
-
0021406605
-
Generalized scaling theory and its application to a 1/4 micrometer MOSFET design
-
G. Baccarani, M. R. Wordeman, and R. H. Dennard, "Generalized scaling theory and its application to a 1/4 micrometer MOSFET design," IEEE Trans. Electron Device, vol. 31, pp. 452-462, Apr. 1984.
-
(1984)
IEEE Trans. Electron Device
, vol.31
, pp. 452-462
-
-
Baccarani, G.1
Wordeman, M.R.2
Dennard, R.H.3
-
6
-
-
0001711161
-
Scaling challanges for DRAM and microprocessors in the 21st century
-
H. Z. Massoud, H. Iwai, C. Claeys, and R. B. Fair, Eds.
-
R. H. Dennard, "Scaling challanges for DRAM and microprocessors in the 21st century," in Proc. ULSI Science and Technology, H. Z. Massoud, H. Iwai, C. Claeys, and R. B. Fair, Eds., 1997, pp. 519-532.
-
(1997)
Proc. ULSI Science and Technology
, pp. 519-532
-
-
Dennard, R.H.1
-
7
-
-
0036508201
-
CMOS design near the limit of scaling
-
D. J. Frank, "CMOS design near the limit of scaling," IBM J. Res. Develop., vol. 46, pp. 213-222, 2002.
-
(2002)
IBM J. Res. Develop.
, vol.46
, pp. 213-222
-
-
Frank, D.J.1
-
8
-
-
0346534582
-
Hafnium and zirconium silicates for advanced gate dielectrics
-
G. D. Wilk, R. M. Wallace, and J. M. Anthony, "Hafnium and zirconium silicates for advanced gate dielectrics," J. Appl. Phys., vol. 87, pp. 484-492, 2000.
-
(2000)
J. Appl. Phys.
, vol.87
, pp. 484-492
-
-
Wilk, G.D.1
Wallace, R.M.2
Anthony, J.M.3
-
9
-
-
0035872897
-
High-k gate dielectrics: Current status and materials properties considerations
-
_, "High-k gate dielectrics: Current status and materials properties considerations," J. Appl. Phys., vol. 89, pp. 5243-5275, 2001.
-
(2001)
J. Appl. Phys.
, vol.89
, pp. 5243-5275
-
-
-
10
-
-
0035498635
-
Ultrathin high-k metal oxides on silicon: Processing, characterization and integration issues
-
E. P. Gusev, E. Cartier, D. A. Buchanan, M. Gribelyuk, M. Copel, H. Okorn-Schmidt, and C. D'Emic, "Ultrathin high-k metal oxides on silicon: Processing, characterization and integration issues," Microel. Eng., vol. 59, no. 1-4, pp. 341-349, 2001.
-
(2001)
Microel. Eng.
, vol.59
, Issue.1-4
, pp. 341-349
-
-
Gusev, E.P.1
Cartier, E.2
Buchanan, D.A.3
Gribelyuk, M.4
Copel, M.5
Okorn-Schmidt, H.6
D'Emic, C.7
-
11
-
-
1242343646
-
Rapid thermal and other short-time processing techniques
-
D. L. Kwong, K. G. Reid, M. C. Ozturk, P. J. Timans, and F. Rooseboom, Eds. Pennington, NJ: ECS
-
3, D. L. Kwong, K. G. Reid, M. C. Ozturk, P. J. Timans, and F. Rooseboom, Eds. Pennington, NJ: ECS, 2001.
-
(2001)
3
-
-
Gusev, E.P.1
Cartier, E.2
Copel, M.3
Gribelyuk, M.4
Buchanan, D.A.5
Okorn-Schmidt, H.6
D'Emic, C.7
Kozlowski, P.8
-
12
-
-
0035716168
-
Ultrathin high-K gate stacks for advanced CMOS devices
-
E. P. Gusev, D. A. Buchanan, E. Cartier, A. Kumar, D. DiMaria, S. Guha, A. Callegari, S. Zafar, P. C. Jamison, D. A. Neumayer, M. Copel, M. A. Gribelyuk, H. Okorn-Schmidt, C. D'Emic, P. Kozlowski, K. Chan, N. Bojarczuk, L.-Å. Ragnarsson, R. Ronsheim, K. Rim, R. J. Fleming, A. Mocuta, and A. Ajmera, "Ultrathin high-K gate stacks for advanced CMOS devices," in Proc. IEEE IEDM Tech. Dig., 2001, pp. 451-454.
-
(2001)
Proc. IEEE IEDM Tech. Dig.
, pp. 451-454
-
-
Gusev, E.P.1
Buchanan, D.A.2
Cartier, E.3
Kumar, A.4
DiMaria, D.5
Guha, S.6
Callegari, A.7
Zafar, S.8
Jamison, P.C.9
Neumayer, D.A.10
Copel, M.11
Gribelyuk, M.A.12
Okorn-Schmidt, H.13
D'Emic, C.14
Kozlowski, P.15
Chan, K.16
Bojarczuk, N.17
Ragnarsson, L.-Å.18
Ronsheim, R.19
Rim, K.20
Fleming, R.J.21
Mocuta, A.22
Ajmera, A.23
more..
-
13
-
-
0000551766
-
Electrical properties of hafnium silicate gate dielectrics deposited directly on silicon
-
G. D. Wilk and R. M. Wallace, "Electrical properties of hafnium silicate gate dielectrics deposited directly on silicon," Appl. Phys. Lett., vol. 74, pp. 2854-2856, 1999.
-
(1999)
Appl. Phys. Lett.
, vol.74
, pp. 2854-2856
-
-
Wilk, G.D.1
Wallace, R.M.2
-
14
-
-
0035472027
-
Group IV metal oxides high permittivity gate insulators deposited from anhydrous metal nitrates
-
Oct.
-
T. Ma, S. A. Campbell, R. Smith, N. Hoilien, B. He, W. L. Gladfelter, C. Hobbs, D. Buchanan, C. Taylor, M. Gribelyuk, M. Tiner, M. Coppel, and J. J. Lee, "Group IV metal oxides high permittivity gate insulators deposited from anhydrous metal nitrates," IEEE Trans. Electron Dev., vol. 48, pp. 2348-2356, Oct. 2001.
-
(2001)
IEEE Trans. Electron Dev.
, vol.48
, pp. 2348-2356
-
-
Ma, T.1
Campbell, S.A.2
Smith, R.3
Hoilien, N.4
He, B.5
Gladfelter, W.L.6
Hobbs, C.7
Buchanan, D.8
Taylor, C.9
Gribelyuk, M.10
Tiner, M.11
Coppel, M.12
Lee, J.J.13
-
15
-
-
0343168081
-
Electrical characteristics of highly reliable ultrathin hafnium oxide gate dielectric
-
Apr.
-
L. Kang, B. H. Lee, W. J. Qi, Y. Jeon, R. Nieh, S. Gopalan, K. Onishi, and J. C. Lee, "Electrical characteristics of highly reliable ultrathin hafnium oxide gate dielectric," IEEE Electron Device Lett., vol. 21, pp. 181-183, Apr. 2000.
-
(2000)
IEEE Electron Device Lett.
, vol.21
, pp. 181-183
-
-
Kang, L.1
Lee, B.H.2
Qi, W.J.3
Jeon, Y.4
Nieh, R.5
Gopalan, S.6
Onishi, K.7
Lee, J.C.8
-
17
-
-
0034454056
-
3 gate dielectric for ULSI applications
-
3 gate dielectric for ULSI applications," Proc. IEEE IEDM Tech. Dig., pp. 223-226, 2000.
-
(2000)
Proc. IEEE IEDM Tech. Dig.
, pp. 223-226
-
-
Buchanan, D.A.1
Gusev, E.P.2
Cartier, E.3
Okorn-Schmidt, H.4
Rim, K.5
Gribelyuk, M.A.6
Mocuta, A.7
Ajmera, A.8
Copel, M.9
Guha, S.10
Bojarczuk, N.11
Callegari, A.12
D'Emic, C.13
Kozlowski, P.14
Chan, K.15
Fleming, R.J.16
Jamison, P.C.17
Brown, J.18
Arndt, R.19
-
18
-
-
0035498635
-
Ultrathin high-k metal oxides on silicon: Processing, characterization, and integration issues
-
E. P. Gusev, E. Cartier, D. A. Buchanan, M. A. Gribelyuk, M. Copel, H. Okorn-Schmidt, and C. D'Emic, "Ultrathin high-k metal oxides on silicon: Processing, characterization, and integration issues," Microelectron. Reliab., vol. 59, pp. 341-349, 2001.
-
(2001)
Microelectron. Reliab.
, vol.59
, pp. 341-349
-
-
Gusev, E.P.1
Cartier, E.2
Buchanan, D.A.3
Gribelyuk, M.A.4
Copel, M.5
Okorn-Schmidt, H.6
D'Emic, C.7
-
19
-
-
1642267430
-
Effects of radiation and charge trapping on the reliability of high-k gate dielectrics
-
Feb.
-
J. A. Felix, J. R. Schwank, D. M. Fleetwood, M. R. Shaneyfelt, and E. P. Gusev, "Effects of radiation and charge trapping on the reliability of high-k gate dielectrics," Microel. Reliab., vol. 44, pp. 563-575, Feb. 2004.
-
(2004)
Microel. Reliab.
, vol.44
, pp. 563-575
-
-
Felix, J.A.1
Schwank, J.R.2
Fleetwood, D.M.3
Shaneyfelt, M.R.4
Gusev, E.P.5
-
20
-
-
1242333056
-
y/Si(100) gate dielectric stacks
-
Dec.
-
y/Si(100) gate dielectric stacks," IEEE Trans. Nucl. Sci., vol. 50, pp. 1910-1917, Dec. 2003.
-
(2003)
IEEE Trans. Nucl. Sci.
, vol.50
, pp. 1910-1917
-
-
Felix, J.A.1
Shaneyfelt, M.R.2
Fleetwood, D.M.3
Meisenheimer, T.L.4
Schwank, J.R.5
Schrimpf, R.D.6
Dodd, P.E.7
Gusev, E.P.8
D'Emic, C.9
-
21
-
-
0033343190
-
The role of electron transport and trapping in MOS total-dose modeling
-
Dec.
-
D. M. Fleetwood, P. S. Winokur, L. C. Riewe, O. Flament, P. Paillet, and J. L. Leray, "The role of electron transport and trapping in MOS total-dose modeling," IEEE Trans. Nucl. Sci., vol. 46, pp. 1519-1525, Dec. 1999.
-
(1999)
IEEE Trans. Nucl. Sci.
, vol.46
, pp. 1519-1525
-
-
Fleetwood, D.M.1
Winokur, P.S.2
Riewe, L.C.3
Flament, O.4
Paillet, P.5
Leray, J.L.6
-
22
-
-
0000686414
-
The effect of postoxidation anneal temperature on radiation-induced charge trapping in polycrystalline silicon gate metal-oxide-semiconductor devices
-
J. R. Schwank and D. M. Fleetwood, "The effect of postoxidation anneal temperature on radiation-induced charge trapping in polycrystalline silicon gate metal-oxide-semiconductor devices," Appl. Phys. Lett., vol. 53, pp. 770-772, 1988.
-
(1988)
Appl. Phys. Lett.
, vol.53
, pp. 770-772
-
-
Schwank, J.R.1
Fleetwood, D.M.2
-
23
-
-
21544480403
-
Effects of oxide traps, interface traps, and "border traps" on metal-oxide-semiconductor devices
-
D. M. Fleetwood, P. S. Winokur, R. A. Reber Jr., T. L. Meisenheimer, and J. R. Schwank, "Effects of oxide traps, interface traps, and "border traps" on metal-oxide-semiconductor devices," J. Appl. Phys., vol. 73, pp. 5058-5074, 1993.
-
(1993)
J. Appl. Phys.
, vol.73
, pp. 5058-5074
-
-
Fleetwood, D.M.1
Winokur, P.S.2
Reber Jr., R.A.3
Meisenheimer, T.L.4
Schwank, J.R.5
-
24
-
-
0036956117
-
Total dose radiation response of hafnium silicate capacitors
-
Dec.
-
J. A. Felix, D. M. Fleetwood, R. D. Schrimpf, J. G. Hong, G. Lucovsky, J. R. Schwank, and M. R. Shaneyfelt, "Total dose radiation response of hafnium silicate capacitors," IEEE Trans. Nucl. Sci, vol. 49, pp. 3191-3199, Dec. 2002.
-
(2002)
IEEE Trans. Nucl. Sci.
, vol.49
, pp. 3191-3199
-
-
Felix, J.A.1
Fleetwood, D.M.2
Schrimpf, R.D.3
Hong, J.G.4
Lucovsky, G.5
Schwank, J.R.6
Shaneyfelt, M.R.7
-
25
-
-
1642587665
-
y/Si(100) gate dielectric stacks after exposure to ionizing radiation
-
y/Si(100) gate dielectric stacks after exposure to ionizing radiation," Microel. Reliab., vol. 72, pp. 50-54, 2004.
-
(2004)
Microel. Reliab.
, vol.72
, pp. 50-54
-
-
Felix, J.A.1
Xiong, H.D.2
Fleetwood, D.M.3
Gusev, E.P.4
Schrimpf, R.D.5
Sternberg, A.L.6
D'Emic, C.7
-
26
-
-
0021599338
-
Radiation effects in MOS capacitors with very thin oxides at 80 K
-
Dec.
-
N. S. Saks, M. G. Ancona, and J. A. Modolo, "Radiation effects in MOS capacitors with very thin oxides at 80 K," IEEE Trans. Nucl. Sci., vol. 31, pp. 1249-1255, Dec. 1984.
-
(1984)
IEEE Trans. Nucl. Sci.
, vol.31
, pp. 1249-1255
-
-
Saks, N.S.1
Ancona, M.G.2
Modolo, J.A.3
-
27
-
-
0033342341
-
Total-dose tolerance of a chartered semiconductor 0.35 μm CMOS process
-
Norfolk, VA, July
-
R. C. Lacoe, J. V. Osborn, D. C. Mayer, S. C. Witczak, S. Brown, and R. Robertson, "Total-dose tolerance of a chartered semiconductor 0.35 μm CMOS process," in Proc. IEEE Radiation Effects Data Workshop, Norfolk, VA, July 1999, pp. 82-86.
-
(1999)
Proc. IEEE Radiation Effects Data Workshop
, pp. 82-86
-
-
Lacoe, R.C.1
Osborn, J.V.2
Mayer, D.C.3
Witczak, S.C.4
Brown, S.5
Robertson, R.6
-
28
-
-
0032095217
-
Total dose hardness of three commercial CMOS microelectronic foundries
-
Dec.
-
J. V. Osborn, R. C. Lacoe, D. C. Mayer, and G. Yabiku, "Total dose hardness of three commercial CMOS microelectronic foundries," IEEE Trans. Nucl. Sci., vol. 45, pp. 1458-1463, Dec. 1998.
-
(1998)
IEEE Trans. Nucl. Sci.
, vol.45
, pp. 1458-1463
-
-
Osborn, J.V.1
Lacoe, R.C.2
Mayer, D.C.3
Yabiku, G.4
-
29
-
-
0022201163
-
Hole removal in thin-gate MOSFETs by tunneling
-
Dec.
-
J. M. Benedetto, H. E. Boesch Jr., F. B. McLean, and J. P. Mize, "Hole removal in thin-gate MOSFETs by tunneling," IEEE Trans. Nucl. Sci., vol. 32, pp. 3916-3920, Dec. 1985.
-
(1985)
IEEE Trans. Nucl. Sci.
, vol.32
, pp. 3916-3920
-
-
Benedetto, J.M.1
Boesch Jr., H.E.2
McLean, F.B.3
Mize, J.P.4
-
30
-
-
0020936776
-
Predicting CMOS inverter response in nuclear and space environments
-
Dec.
-
P. S. Winokur, K. G. Kerris, and L. Harper, "Predicting CMOS inverter response in nuclear and space environments," IEEE Trans. Nucl. Sci., vol. 30, pp. 4326-4332, Dec. 1983.
-
(1983)
IEEE Trans. Nucl. Sci.
, vol.30
, pp. 4326-4332
-
-
Winokur, P.S.1
Kerris, K.G.2
Harper, L.3
-
31
-
-
0022865241
-
Spatial dependence of trapped holes determined from tunneling analysis and measured annealing
-
Dec.
-
T. R. Oldham, A. J. Lelis, and F. B. McLean, "Spatial dependence of trapped holes determined from tunneling analysis and measured annealing," IEEE Trans. Nucl. Sci., vol. 33, no. 6, pp. 1203-1209, Dec. 1986.
-
(1986)
IEEE Trans. Nucl. Sci.
, vol.33
, Issue.6
, pp. 1203-1209
-
-
Oldham, T.R.1
Lelis, A.J.2
Mclean, F.B.3
-
32
-
-
0002772669
-
-
T. P. Ma and P. V. Dressendorfer, Eds. New York: Wiley, ch. Ionizing Effects in MOS Devices and Circuits
-
2, T. P. Ma and P. V. Dressendorfer, Eds. New York: Wiley, 1989, ch. Ionizing Effects in MOS Devices and Circuits, pp. 87-192.
-
(1989)
2
, pp. 87-192
-
-
Mclean, F.B.1
Boesch Jr., H.E.2
Oldham, T.R.3
-
33
-
-
0039436914
-
2 and Si-O-N gate dielectric layers for silicon microelectronics: Understanding the processing, structure, and physical and electrical limits
-
2 and Si-O-N gate dielectric layers for silicon microelectronics: Understanding the processing, structure, and physical and electrical limits," J. Appl. Phys., vol. 90, no. 5, pp. 2057-2121, 2001.
-
(2001)
J. Appl. Phys.
, vol.90
, Issue.5
, pp. 2057-2121
-
-
Green, M.L.1
Gusev, E.P.2
Degraeve, R.3
Garfunkel, E.L.4
-
34
-
-
0025669259
-
Modeling the anneal of radiation-induced trapped holes in a varying thermal environment
-
Dec.
-
P. J. McWhorter, S. L. Miller, and W. M. Miller, "Modeling the anneal of radiation-induced trapped holes in a varying thermal environment," IEEE Trans. Nucl. Sci., vol. 37, pp. 1682-1689, Dec. 1990.
-
(1990)
IEEE Trans. Nucl. Sci.
, vol.37
, pp. 1682-1689
-
-
McWhorter, P.J.1
Miller, S.L.2
Miller, W.M.3
-
35
-
-
0021587257
-
Physical mechanisms contributing to devices rebound
-
Dec.
-
J. R. Schwank, P. S. Winokur, P. J. McWhorter, F. W. Sexton, P. V. Dressendorfer, and D. C. Turpin, "Physical mechanisms contributing to devices rebound," IEEE Trans. Nucl. Sci., vol. 31, pp. 1434-1438, Dec. 1984.
-
(1984)
IEEE Trans. Nucl. Sci.
, vol.31
, pp. 1434-1438
-
-
Schwank, J.R.1
Winokur, P.S.2
McWhorter, P.J.3
Sexton, F.W.4
Dressendorfer, P.V.5
Turpin, D.C.6
-
36
-
-
0001031584
-
2
-
2," Appl. Phys. Lett., vol. 74, pp. 2969-2971, 1999.
-
(1999)
Appl. Phys. Lett.
, vol.74
, pp. 2969-2971
-
-
Fleetwood, D.M.1
Winokur, P.S.2
Flament, O.3
Leray, J.L.4
-
37
-
-
0033313560
-
2
-
2," Microelectron. Reliab., vol. 39, pp. 1323-1336, 1999.
-
(1999)
Microelectron. Reliab.
, vol.39
, pp. 1323-1336
-
-
Fleetwood, D.M.1
Reber Jr., R.A.2
Riewe, L.C.3
Winokur, P.S.4
-
39
-
-
0027539636
-
Generalization of the method of maximum likelihood
-
Feb.
-
J. Jacquelin, "Generalization of the method of maximum likelihood," IEEE Trans. Electon. Insul., vol. 28, pp. 65-72, Feb. 1993.
-
(1993)
IEEE Trans. Electon. Insul.
, vol.28
, pp. 65-72
-
-
Jacquelin, J.1
-
40
-
-
0036540855
-
Low Weibull slope of breakdown distributions in high-k layers
-
Mar.
-
T. Kauerauf, R. Degraeve, E. Cartier, C. Soens, and G. Groeseneken, "Low Weibull slope of breakdown distributions in high-k layers," IEEE Electron Device Lett., vol. 23, pp. 215-217, Mar. 2002.
-
(2002)
IEEE Electron Device Lett.
, vol.23
, pp. 215-217
-
-
Kauerauf, T.1
Degraeve, R.2
Cartier, E.3
Soens, C.4
Groeseneken, G.5
-
41
-
-
18644367764
-
2 gate dielectrics
-
Oct.
-
2 gate dielectrics," IEEE Electron Dev. Lett., vol. 23, pp. 594-596, Oct. 2002.
-
(2002)
IEEE Electron Dev. Lett.
, vol.23
, pp. 594-596
-
-
Kim, Y.-H.1
Onishi, K.2
Kang, C.S.3
Cho, H.-J.4
Nieh, R.5
Gopalan, S.6
Choi, R.7
Han, J.8
Krishnan, S.9
Lee, J.C.10
-
43
-
-
0037002325
-
On the Weibull shape factor of intrinsic breakdown of dielectric films and its accurate experimental determination - Part I: Theory, methodology, experimental techniques
-
Dec.
-
E. Y. Wu and R.-P. Vollersten, "On the Weibull shape factor of intrinsic breakdown of dielectric films and its accurate experimental determination - Part I: Theory, methodology, experimental techniques," IEEE Trans. Electon Device, vol. 49, pp. 2131-2140, Dec. 2002.
-
(2002)
IEEE Trans. Electon Device
, vol.49
, pp. 2131-2140
-
-
Wu, E.Y.1
Vollersten, R.-P.2
-
44
-
-
0036610919
-
Ultrathin gate oxide reliability: Physical models, statistics, and characterization
-
Dec.
-
J. S. Suehle, "Ultrathin gate oxide reliability: Physical models, statistics, and characterization," IEEE Trans. Electron Device, vol. 49, pp. 958-971, Dec. 2002.
-
(2002)
IEEE Trans. Electron Device
, vol.49
, pp. 958-971
-
-
Suehle, J.S.1
-
45
-
-
0000041835
-
Percolation models for gate oxide breakdown
-
J. H. Stathis, "Percolation models for gate oxide breakdown," J. Appl. Phys., vol. 86, pp. 5757-5766, 1999.
-
(1999)
J. Appl. Phys.
, vol.86
, pp. 5757-5766
-
-
Stathis, J.H.1
-
46
-
-
0008536196
-
New insights in the relation between electron trap generation and the statistical properties of oxide breakdown
-
Apr.
-
R. Degraeve, G. Groeseneken, R. Bellens, J. L. Ogier, M. Depas, P. J. Roussel, and H. E. Maes, "New insights in the relation between electron trap generation and the statistical properties of oxide breakdown," IEEE Trans. Electron Device, vol. 45, pp. 904-911, Apr. 1998.
-
(1998)
IEEE Trans. Electron Device
, vol.45
, pp. 904-911
-
-
Degraeve, R.1
Groeseneken, G.2
Bellens, R.3
Ogier, J.L.4
Depas, M.5
Roussel, P.J.6
Maes, H.E.7
|