Patterning NiB electroless deposited on glass using an electroplated Cu mask, microcontact printing, and wet etching

Langmuir

Volumn 19, Issue 14, 2003, Pages 5892-5897

  Delamarche, Emmanuel ^a   Geissler, Matthias ^a   Magnuson, Roy H ^a,b   Schmid, Heinz ^a   Michel, Bruno ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTROPLATING; ETCHING; GLASS; NICKEL; ORGANIC COMPOUNDS; PHOTOLITHOGRAPHY; SUBSTRATES; X RAY PHOTOELECTRON SPECTROSCOPY;

MICROCONTACT PRINTING; PATTERNING;

ELECTROLESS PLATING;

EID: 0038717551     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la0341658     Document Type: Article

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