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3643136346
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Since the etch for Cr induced pits on the surface of Au/Cr/Si substrates but did not dissolve gold (in independent measurements), we infer that there were regions of the surface where Cr was exposed or where there was a sufficiently thin layer of gold on the Cr to allow penentration of the etching solution for Cr. The observation that the presence of Cr in the gold film did not affect the density of pits observed by chemical amplification for SAM/Au/Cr/Si substrates, even though the ferricyanide-containing etch dissolved Cr, suggests that regions where Cr or Ti were present were protected at a level equivalent to areas of SAM-protected gold. On the basis of this observation, we infer that there was a thin layer of gold (and a SAM) covering the Cr or Ti. Our results do not indicate whether the Cr or Ti was present at the surface as discrete particles or whether it was present as "tubes" that extended entirely through the gold film.
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3643108229
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