New strategy for controlling the size and shape of metallic features formed by electroless deposition of copper: Microcontact printing of catalysts on oriented polymers, followed by thermal shrinkage

Langmuir

Volumn 12, Issue 21, 1996, Pages 5209-5215

  Hidber, Pirmin C ^a   Nealey, Paul F ^a   Helbig, Wolfgang ^a   Whitesides, George M ^a  

^a HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000860135     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la960238u     Document Type: Article

References (50)

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11. Another technique for the fabrication of patterned metal films is chemical vapor deposition (CVD) (Potochnik, S. J.; Pehrsson, P. E.; Hsu, D. S. Y.; Calvert, J. M. Langmuir 1995, 11, 1841-1845. Jeon, N. L.; Nuzzo, R. G.; Xia, Y.; Mrksich, M.; Whitesides, G. M. Langmuir 1995, 11, 3024-3026. Hampden-Smith, M. J.; Kodas, T. T. Chem. Vap. Deposition 1995, 1, 39-48).
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39. We have recently developed other techniques to reduce the minimum feature size accessible by photolithographic methods such as mechanical compression of the stamp (Xia, Y.; Whitesides, G. M. Adv. Mater. 1995, 7, 471-473), molding stamps from etched silicon (Wilbur, J. L.; Kim, E.; Xia, Y.; Whitesides, G. M. Adv. Mater. 1995, 7, 649-652), or molding from compressed stamps (Xia, Y.; Kim, E.; Zhao, X.-M.; Prentiss, M.; Whitesides, G. M. Science 1996, 273, 347-349.
40. We have recently developed other techniques to reduce the minimum feature size accessible by photolithographic methods such as mechanical compression of the stamp (Xia, Y.; Whitesides, G. M. Adv. Mater. 1995, 7, 471-473), molding stamps from etched silicon (Wilbur, J. L.; Kim, E.; Xia, Y.; Whitesides, G. M. Adv. Mater. 1995, 7, 649-652), or molding from compressed stamps (Xia, Y.; Kim, E.; Zhao, X.-M.; Prentiss, M.; Whitesides, G. M. Science 1996, 273, 347-349.
41. We have recently developed other techniques to reduce the minimum feature size accessible by photolithographic methods such as mechanical compression of the stamp (Xia, Y.; Whitesides, G. M. Adv. Mater. 1995, 7, 471-473), molding stamps from etched silicon (Wilbur, J. L.; Kim, E.; Xia, Y.; Whitesides, G. M. Adv. Mater. 1995, 7, 649-652), or molding from compressed stamps (Xia, Y.; Kim, E.; Zhao, X.-M.; Prentiss, M.; Whitesides, G. M. Science 1996, 273, 347-349.
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47. The dimensions of the copper lines for the conductivity measurement were as follows: length, ∼0.4 mm; width, ∼3.7 mu;m, 11.1 μm, 23.2 μm; thickness, ∼0.6 μ.
48. a value of a copper deposited on the unannealed polymer was ∼35 nm.
49. The shrinkage factors of this polymer substrate were the highest we worked with. By using oriented polymers with higher draw ratios, it should however be possible to achieve even higher shrinkage factors.
50. Although we cannot assign each defect directly to one of these sources, we have clear indications that all four are important: First, scratches and wrinkles in the polymer substrates could be identified easily under the microscope; second, we could occasionally identify defects in our stamps under the microscope; third, carrying out the microcontact printing process in the clean room and reducing the influence of particulates resulted in a decrease in the number of defects; fourth, particles formed by decomposition of the plating solution during the metalization process could easily be deposited on the sample surface, since we did not filter the plating solution before or during the metal deposition.