Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe

Applied Physics Letters

Volumn 71, Issue 1, 1997, Pages 61-63

  Kim, P G ^a   Tu, K N ^a   Abbott, D C ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003145801     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.120434     Document Type: Article

References (11)

1. Semiconductor Industry Association, Semiconductor Technology Workshop Working Group Reports (Semiconductor Research Corporation. Research Triangle Park, NC, 1992).
2. R. R. Tummala and E. J. Rymaszewski, Microelectronics Packaging Handbook (Van Nostrand Reinhold, New York, 1989).
3. D. Seraphim, R. Lasky, and C. Li, Principles of Electronic Packaging (McGraw-Hill, New York, 1989).
4. D. C. Abbott, R. M. Brook, N. McLelland, and J. S. Wiley, IEEE Trans. Compon. Hybrids Manuf. Technol. 14, 567 (1991).
5. A. Murata and D. C. Abbott, Tech. Proc. Semicond. Jpn. 415 (1990).
6. Y. Wang, H. K. Kim, H. K. Liou, and K. N. Tu, Scr. Metall. Mater. 32, 2087 (1995).
7. Y. Wang and K. N. Tu, Appl. Phys. Lett. 67, 1069 (1995).
8. S. K. Kang and V. Ramachandran, Scr. Metall. Mater. 14, 421 (1980).
9. S. K. Kang, Metall. Trans. B 12B, 620 (1981).
10. H K. Kim and K. N. Tu, Phys. Rev. B 53, 16 027 (1996).
11. H. K. Kim, K. N. Tu, and P. A. Totta, Appl. Phys. Lett. 68, 2204 (1996).