Fast dissolution and soldering reactions on Au foils

Materials Chemistry and Physics

Volumn 53, Issue 2, 1998, Pages 165-171

  Kim, P G ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Gold foils; Soldering reactions; Thin films

Indexed keywords

DISSOLUTION; EUTECTICS; GOLD; INTERFACES (MATERIALS); INTERMETALLICS; METALLIC FILMS; REACTION KINETICS; SOLDERING; THIN FILMS; TIN ALLOYS; WETTING;

SUNKEN INTERFACES;

METAL FOIL;

EID: 0032074454     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(97)02076-2     Document Type: Article

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