Preparation of solder bumps incorporating electroless nickel-boron deposit and investigation on the interfacial interaction behaviour and wetting kinetics

Journal of Materials Science: Materials in Electronics

Volumn 8, Issue 6, 1997, Pages 377-383

  Lee, Chwan Ying ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINUM; ATOMS; CONTACT ANGLE; DIFFUSION; ELECTROLESS PLATING; INTERFACES (MATERIALS); INTERMETALLICS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SOLDERING; WETTING;

AUGER DEPTH PROFILE; BATH TEMPERATURE; DIPPING VELOCITY; ELECTROLESS NICKEL BORON DEPOSIT; INTERFACIAL INTERACTION; SESSILE DROP METHOD; SOLDER BUMP;

SOLDERING ALLOYS;

EID: 0031375291     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018599609177     Document Type: Article

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