Y2O3 nanosheets as slurry abrasives for chemical-mechanical planarization of copper

Friction

Volumn 1, Issue 4, 2013, Pages 327-332

  He, Xingliang ^a   Chen, Yunyun ^a   Zhao, Huijia ^b   Sun, Haoming ^b   Lu, Xinchun ^b   Liang, Hong ^a  

^a Texas AandM University   (United States)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

chemical mechanical planarization (CMP); nanoabrasives; slurry flow; wafer pad contact; Y2O3 nanosheets

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; INTEGRATED CIRCUITS; LAMINAR FLOW; NANOSHEETS; POLISHING; SURFACE ROUGHNESS; YTTRIUM OXIDE;

COMPARISON WITH A STANDARD; FEATURE DIMENSIONS; GLOBAL PLANARIZATIONS; MANUFACTURING YIELD; NANOABRASIVES; SLURRY FLOW; TWO DIMENSIONAL NANOSHEETS; WITHIN WAFER NON UNIFORMITIES;

ABRASIVES;

EID: 84976465206     PISSN: 22237690     EISSN: 22237704     Source Type: Journal    
DOI: 10.1007/s40544-013-0017-z     Document Type: Article

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