Application of soft landing to the process control of chemical mechanical polishing

Microelectronic Engineering

Volumn 65, Issue 3, 2003, Pages 345-356

  Chiu, Jian Bin ^a   Yu, Cheng Ching ^b   Shen, Shih Haur ^c  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^c Applied Materials Taiwan   (Taiwan)

Author keywords

Chemical mechanical polishing; Damascene; Minimum time problem; Soft landing; STI process control

Indexed keywords

CHEMICAL MECHANICAL POLISHING; OPTIMAL CONTROL SYSTEMS; PROCESS CONTROL; SPACECRAFT; THROUGHPUT;

SOFT LANDING;

MICROELECTRONICS;

EID: 0037363286     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)01024-9     Document Type: Article

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