An analytical dishing and step height reduction model for chemical mechanical planarization (CMP)

IEEE Transactions on Semiconductor Manufacturing

Volumn 16, Issue 3, 2003, Pages 477-485

  Fu, Guanghui ^a   Chandra, Abhijit ^a  

^a Iowa State University   (United States)

Author keywords

CMP; Dishing; Step height reduction

Indexed keywords

BENDING STRENGTH; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; OPTIMIZATION; POLISHING; SILICON WAFERS; SPATIAL VARIABLES CONTROL; STIFFNESS;

CHEMICAL MECHANICAL PLANARIZATION; DISHING; PATTERN LAYOUT; PRESTONS CONSTANT; STEP HEIGHT REDUCTION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0041885507     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2003.815202     Document Type: Article

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