Copper CMP: The relationship between polish rate uniformity and lubrication

ECS Journal of Solid State Science and Technology

Volumn 1, Issue 4, 2012, Pages

  Nolan, L ^a   Cadien, K ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84887355936     PISSN: 21628769     EISSN: 21628777     Source Type: Journal    
DOI: 10.1149/2.004204jss     Document Type: Article

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