메뉴 건너뛰기




Volumn 42, Issue 11, 2003, Pages 6809-6814

Tribology and Removal Rate Characteristics of Abrasive-Free Slurries for Copper CMP Applications

Author keywords

Abrasive free CMP; Chemical mechanical planarization (CMP); Copper CMP; Fourier transform spectral analysis

Indexed keywords

ABRASION; CHEMICAL MECHANICAL POLISHING; COMPLEXATION; CORROSION INHIBITORS; FLOW OF FLUIDS; FOURIER TRANSFORMS; FRICTION; LUBRICATION; PRESSURE EFFECTS; SILICA; SLURRIES; SPECTRUM ANALYSIS; TRIBOLOGY;

EID: 1642577079     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.6809     Document Type: Article
Times cited : (40)

References (10)
  • 5
    • 1642572850 scopus 로고    scopus 로고
    • Master's Thesis, University of Arizona, Tucson, AZ
    • S. F. Olsen: Master's Thesis, University of Arizona, Tucson, AZ, 2002.
    • (2002)
    • Olsen, S.F.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.