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Volumn 42, Issue 11, 2003, Pages 6809-6814
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Tribology and Removal Rate Characteristics of Abrasive-Free Slurries for Copper CMP Applications
a a b c a
b
HITACHI LTD
(Japan)
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Author keywords
Abrasive free CMP; Chemical mechanical planarization (CMP); Copper CMP; Fourier transform spectral analysis
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Indexed keywords
ABRASION;
CHEMICAL MECHANICAL POLISHING;
COMPLEXATION;
CORROSION INHIBITORS;
FLOW OF FLUIDS;
FOURIER TRANSFORMS;
FRICTION;
LUBRICATION;
PRESSURE EFFECTS;
SILICA;
SLURRIES;
SPECTRUM ANALYSIS;
TRIBOLOGY;
FRICTION COEFFICIENTS;
INTERLAYER DIELECTRICS (ILD);
COPPER;
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EID: 1642577079
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.42.6809 Document Type: Article |
Times cited : (40)
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References (10)
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