Chemical boundary lubrication in chemical-mechanical planarization

Tribology International

Volumn 38, Issue 3, 2005, Pages 235-242

  Liang, Hong ^a  

^a University of Alaska Fairbanks   (United States)

Author keywords

Chemical mechanical planarization

Indexed keywords

CHEMICAL BOUNDARY LUBRICATION (CBL); CHEMICAL MECHANICAL PLANARIZATION (CMP); NANOPARTICLES; POLYMERIC POLISHING PADS;

ABRASIVES; INTEGRATED CIRCUIT MANUFACTURE; LUBRICATION; NANOSTRUCTURED MATERIALS; PASSIVATION; TRIBOLOGY; VISCOSITY; WEAR OF MATERIALS;

CHEMICAL MECHANICAL POLISHING;

EID: 11444254916     PISSN: 0301679X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.triboint.2004.08.006     Document Type: Conference Paper

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