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Volumn 156, Issue 12, 2009, Pages

A material removal model for CMP based on the contact mechanics of pad, abrasives, and wafer

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVE PARTICLES; ABRASIVE WEARS; APPLIED PRESSURE; CONTACT INTERFACE; CONTACT MECHANICS; DIFFERENT SCALE; EFFECT OF CHEMICALS; FINITE ELEMENT MODELING; MATERIAL REMOVAL; MATERIAL REMOVAL MODEL; MATERIAL REMOVAL RATE; PARTICLE CONTACTS; RIGID PARTICLES; SIGNIFICANT FACTORS; WAFER CONTACTS; WAFER SURFACE; WEAR RATES;

EID: 70350724324     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3231691     Document Type: Article
Times cited : (54)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.