In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

Scientific Reports

Volumn 6, Issue , 2016, Pages

  Shen, Hao ^a   Zhu, Wenxin ^a   Li, Yao ^a   Tamura, Nobumichi ^b   Chen, Kai ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84973346037     PISSN: None     EISSN: 20452322     Source Type: Journal    
DOI: 10.1038/srep24418     Document Type: Article

References (41)

1. Blech, I. A. Electromigration in thin aluminum films on titanium nitride. J. Appl. Phys. 47, 1203-1208 (1976).
2. Tu, K. N. Recent advances on electromigration in very-large-scale-integration of interconnects. J. Appl. Phys. 94, 5451 (2003).
3. Valek, B. C. et al. Electromigration-induced plastic deformation in passivated metal lines. Appl. Phys. Lett. 81, 4168 (2002).
4. Valek, B. C. et al. Early stage of plastic deformation in thin films undergoing electromigration. J. Appl. Phys. 94, 3757 (2003).
5. Chen, K., Tamura, N., Valek, B. C. & Tu, K. N. Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction. J. Appl. Phys. 104, 013513 (2008).
6. Budiman, A. S. et al. Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction. Appl. Phys. Lett. 88, 233515 (2006).
7. Budiman, A. S. et al. Electromigration-induced plastic deformation in Cu interconnects: effects on current density exponent, n, and implications for EM reliability assessment. J. Electron. Mater. 39, 2483-2488 (2010).
8. Wu, A. T. et al. Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction. Appl. Phys. Lett. 85, 2490-2492 (2004).
9. Wu, A. T., Gusak, A. M., Tu, K. N. & Kao, C. R. Electromigration-induced grain rotation in anisotropic conducting beta tin. Appl. Phys. Lett. 86, 241902 (2005).
10. Mason, W. P. & Bommel, H. E. Ultrasonic Attenuation at Low Temperatures for Metals in the Normal and Superconducting States. J. Acoust. Soc. Am. 28, 930-943 (1956).
11. Huang, F. H. & Huntington, H. B. Diffusion of Sb124, Cd109, Sn113, and Zn65 in tin. Phys. Rev. B 9, 1479-1488 (1974).
12. Yeh, E. C. C., Choi, W. J., Tu, K. N., Elenius, P. & Balkan, H. Current-crowding-induced electromigration failure in flip chip solder joints. Appl. Phys. Lett. 80, 580 (2002).
13. Zhang, L. et al. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints. Appl. Phys. Lett. 88, 012106 (2006).
14. Ouyang, F.-Y., Chen, K., Tu, K. N. & Lai, Y.-S. Effect of current crowding on whisker growth at the anode in flip chip solder joints. Appl. Phys. Lett. 91, 231919 (2007).
15. Chen, K., Tamura, N., Kunz, M., Tu, K. N. & Lai, Y.-S. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction. J. Appl. Phys. 106, 023502 (2009).
16. Li, Y., Wan, L. & Chen, K. A look-up table based approach to characterize crystal twinning for synchrotron X-ray Laue microdiffraction scans. J. Appl. Cryst. 48, 747-757 (2015).
17. Lu, M., Shih, D.-Y., Lauro, P., Goldsmith, C. & Henderson, D. W. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders. Appl. Phys. Lett. 92, 211909 (2008).
18. Chen, K. et al. High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction. J. Appl. Phys. 107, 063502 (2010).
19. Chen, K., Kunz, M., Tamura, N. & Wenk, H. R. Residual stress preserved in quartz from the San Andreas Fault Observatory at Depth. Geology 43, 219-222 (2015).
20. Tu, K. N. & Turnbull, D. Direct observation of twinning in tin lamellae. Acta Metall. 18, 915-929 (1970).
21. Nye, J. F. Physical Properties of Crystals: Their Representation by Tensors and Matrices. Oxford University Press 24-26 (1985).
22. Barabash, R. I. et al. Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect. J. Appl. Phys. 93, 5701 (2003).
23. Ice, G. E. & Barabash, R. I. White Beam Microdiffraction and Dislocations Gradients. In: Dislocations in Solids (Nabarro, F. R. N. & Hirth, J. P.) Elsevier 499-601 (2007).
24. Lupinacci, A. et al. Characterization of ion beam irradiated 304 stainless steel utilizing nanoindentation and Laue microdiffraction. J. Nucl. Mater. 458, 70-76 (2015).
25. Moldovan, D., Wolf, D. & Phillpot, S. R. Theory of diffusion-accommodated grain rotation in columnar polycrystalline microstructures. Acta Mater. 49, 3521-3532 (2001).
26. Harris, K. E., Singh, V. V. & King, A. H. Grain rotation in thin films of gold. Acta Mater. 46, 2623-2633 (1998).
27. Yang, F. & Yang, W. Kinetics and size effect of grain rotations in nanocrystals with rounded triple junctions. Scripta Mater. 61, 919-922 (2009).
28. Tian, L., Li, J., Sun, J., Ma, E. & Shan, Z. W. Visualizing size-dependent deformation mechanism transition in Sn. Sci. Rep. 3, 2113 (2013).
29. Shan, Z. W., Mishra, R. K., Syed Asif, S. A., Warren, O. L. & Minor, A. M. Mechanical annealing and source-limited deformation in submicron-diameter Ni crystals. Nature Mater. 7, 115-119 (2008).
30. Burek, M. J. et al. Grain boundary effects on the mechanical properties of bismuth nanostructures. Acta Mater. 59, 4709-4718 (2011).
31. Burek, M. J. et al. Fabrication, microstructure, and mechanical properties of tin nanostructures. Mater. Sci. Eng. A 528, 5822-5832 (2011).
32. Lee, G. et al. Fabrication, structure and mechanical properties of indium nanopillars. Acta Mater. 58, 1361-1368 (2010).
33. Choi, W. J. et al. Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction. Acta Mater. 51, 6253-6261 (2003).
34. Lee, B. & Lee, D. Spontaneous growth mechanism of tin whiskers. Acta Mater. 46, 3701-3714 (1998).
35. Huang, A. T., Gusak, A. M., Tu, K. N. & Lai, Y.-S. Thermomigration in SnPb composite flip chip solder joints. Appl. Phys. Lett. 88, 141911 (2006).
36. Kunz, M. et al. A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source. Rev. Sci. Instrum. 80, 035108 (2009).
37. Tamura, N. XMAS: A Versatile Tool for Analyzing Synchrotron X-ray Microdiffraction Data. In: Strain and Dislocation Gradients from Diffraction (Ice, G. E. & Barabash, R.) Imperial College Press 125-155 (2014).
38. Ungar, T., Revesz, A. & Borbely, A. Dislocations and grain size in electrodeposited nanocrystalline Ni determined by the modified Williamson-Hall and Warren-Averbach procedures. J. Appl. Cryst. 31, 554-558 (1998).
39. Shin, H.-A. S. et al. Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing. J. Electron. Mater. 41, 712-719 (2012).
40. Li, Y. et al. A synchrotron study of defect and strain inhomogeneity in laser-assisted three-dimensionally-printed Ni-based superalloy. Appl. Phys. Lett. 107, 181902 (2015).
41. Xue, J. et al. A synchrotron study of microstructure gradient in laser additively formed epitaxial Ni-based superalloy. Sci. Rep. 5, 14903 (2015).