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Applied Physics Letters

Volumn 85, Issue 13, 2004, Pages 2490-2492

Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction

(6) Wu, Albert T a Tu, K N a Lloyd, J R b Tamura, N c Valek, B C c Kao, C R d

a UNIVERSITY OF CALIFORNIA (United States)

b IBM T J WATSON RESEARCH CENTER (United States)

c LAWRENCE BERKELEY NATIONAL LABORATORY (United States)

d NATIONAL CENTRAL UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED LIGHT SOURCE (ALS); LATTICE DIFFUSION; VACANCY DIFFUSION; X-RAY MICRODIFFRACTION;

ACTIVATION ENERGY; DIFFUSION; ELECTROMIGRATION; ELECTRON DIFFRACTION; ENERGY DISSIPATION; GRAIN BOUNDARIES; GRAIN GROWTH; MATHEMATICAL MODELS; MICROSTRUCTURE; RAPID THERMAL ANNEALING; SINGLE CRYSTALS; SYNCHROTRONS;

TIN;

EID: 7544234470 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.1795353 Document Type: Article

Times cited : (68)

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