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Journal of Applied Physics

Volumn 107, Issue 6, 2010, Pages

High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction

(7) Chen, Kai a,b,d Tamura, N a Tang, Wei b Kunz, M a Chou, Yi Chia b Tu, K N b Lai, Yi Shao c

a LAWRENCE BERKELEY NATIONAL LABORATORY (United States)

b UNIVERSITY OF CALIFORNIA (United States)

c ADVANCED SEMICONDUCTOR ENGINEERING INC (Taiwan)

d UNIVERSITY OF CALIFORNIA (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING ANGLE; FLIP CHIP; HIGH PRECISION; LAUE DIFFRACTION PATTERNS; LOCAL CURVATURE; LOCAL STRESS DISTRIBUTION; MEASURED CURVATURE; ORIENTATION INFORMATION; POLYCHROMATIC X-RAY MICRODIFFRACTION; SOLDER JOINTS; STRESS-STRAIN; SYNCHROTRON X RAYS;

DIFFRACTION; HOLOGRAPHIC INTERFEROMETRY; STRESS CONCENTRATION; SYNCHROTRONS; THERMAL STRESS; THERMOELASTICITY; X RAY DIFFRACTION;

THERMAL EXPANSION;

EID: 77950558995 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3309750 Document Type: Conference Paper

Times cited : (20)

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