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Volumn 106, Issue 2, 2009, Pages

In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction

(5) Chen, Kai a,b Tamura, N a Kunz, M a Tu, K N b Lai, Yi Shao c

a LAWRENCE BERKELEY NATIONAL LABORATORY (United States)

b UNIVERSITY OF CALIFORNIA (United States)

c ADVANCED SEMICONDUCTOR ENGINEERING INC (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATED VALUES; CRYSTALLOGRAPHIC ORIENTATIONS; EFFECTIVE CHARGE; ELASTIC ANISOTROPY; ELASTIC STRESS; FUNCTION OF TIME; IN-SITU MEASUREMENT; IN-SITU SYNCHROTRONS; MICRODIFFRACTIONS; PB-FREE; SN WHISKER; SN-CU SOLDERS; STEADY STATE; TEMPERATURE FLUCTUATION; TRANSIENT STRESS; WHITE BEAMS;

BRAZING; COMPRESSIVE STRESS; CRYSTAL ORIENTATION; DIFFRACTION; ELECTROMIGRATION; LEAD; LEAD ALLOYS; SINGLE CRYSTALS; SYNCHROTRONS; TENSILE STRESS; WELDING;

TIN;

EID: 68249133844 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3157196 Document Type: Article

Times cited : (29)

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