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Volumn 93, Issue 9, 2003, Pages 5701-5706

Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt% Cu) interconnect

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; ELECTROMIGRATION; INTEGRATED CIRCUITS; PASSIVATION; PLASTIC DEFORMATION; X RAY DIFFRACTION ANALYSIS;

EID: 0037960114     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1563033     Document Type: Article
Times cited : (35)

References (31)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.