Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films

Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 9, 2011, Pages 1372-1377

  Haseeb, A S M A ^a   Chew, C S ^a   Johan, Mohd Rafie ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER FILMS; BRIGHT LAYER; CITRATE BATHS; COATED SUBSTRATES; COPPER SUBSTRATES; CROSS-SECTIONAL SCANNING ELECTRON MICROSCOPIES; ELECTRON BACK SCATTER DIFFRACTION; ENERGY DISPERSIVE X RAY SPECTROSCOPY; FACETED MORPHOLOGY; FAST DIFFUSION; LEAD FREE SOLDERS; NI-W ALLOY; NICKEL BASED ALLOY; REFLOW TEMPERATURES; SOLDER JOINTS; SOLID-STATE AMORPHIZATION; TERNARY PHASE; TUNGSTEN CONTENT;

ALLOYS; AMORPHOUS FILMS; CERIUM ALLOYS; FILM PREPARATION; INVESTMENTS; METALLIC FILMS; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; TIN ALLOYS; TUNGSTEN; TUNGSTEN ALLOYS; X RAY SPECTROSCOPY;

TIN;

EID: 80054966336     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0316-y     Document Type: Article

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