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Volumn 23, Issue 7, 2012, Pages 1409-1414

Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION EFFECTS; AGING TIME; COMPOSITE SOLDERS; CU SUBSTRATE; IMC LAYER; MICRO-PARTICLES; SOLDER JOINTS; SOLDER PASTE;

EID: 84863982478     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0606-4     Document Type: Article
Times cited : (10)

References (18)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.