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Volumn 23, Issue 7, 2012, Pages 1409-1414
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Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging
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Author keywords
[No Author keywords available]
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Indexed keywords
ABSORPTION EFFECTS;
AGING TIME;
COMPOSITE SOLDERS;
CU SUBSTRATE;
IMC LAYER;
MICRO-PARTICLES;
SOLDER JOINTS;
SOLDER PASTE;
MICROSTRUCTURAL EVOLUTION;
NANOPARTICLES;
REINFORCEMENT;
SCANNING ELECTRON MICROSCOPY;
SILVER;
SOLDERING ALLOYS;
TIN;
LIQUIDS;
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EID: 84863982478
PISSN: 09574522
EISSN: 1573482X
Source Type: Journal
DOI: 10.1007/s10854-011-0606-4 Document Type: Article |
Times cited : (10)
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References (18)
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